EEks, thats a yuckkky way to test.... Temperature Chamber is the way to test. in event of failure, use Heat Gun(s) (described in IEEE Specifications). <note: guns is plural> It is important that components whose characterstic changes (like Analog PLL, Oscialators, VCXO) with the change in Temperature must be tested and in turn test the compnents which depends on the characterstic/performance of those components. Also remeber that the Board Characterstic Changes (i.e. Z) with change in Frequency (which depends on Temperature) Temprature Tests provides the following functionality of the processor: 1. OverClocking / Underclocking 2. Static and Dynamic Timing Analysis 3. Signal Integrity, Reflections, SSO/Cross Talk (we are talking of the oscillator characterstics to change with increse in Tempertaure) Analysis of a Waveform attached. Anurag Darbari ----- Original Message ----- From: "Marco Braga" <> To: "Jeff Brower" <> Cc: <> Sent: Thursday, March 03, 2005 8:55 AM Subject: Re: [c6x] Re: 6713 overclocking > Hi Jeff, > >> Let's put it this way: if my box failed under extended temp conditions, >> and my >> customer asked me "how did you test it?", I would not want to say "I used >> a hair >> drier". > > Eheheheh!! Of course. I was just talking about my personal tests, > nothing serius or scientific. Simply I was amazed seeing my complex > app still run at 792Mhz with really hot air blowing on the board. > Nothing more. :) > > -- > Best regards, Reply to: > Marco Braga > Insignis Technologies |
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